Sealing material ring for a semiconductor manufacturing apparatus



FIG. 1 is a front, bottom, and right side perspective view of a sealing material ring for a semiconductor manufacturing apparatus, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a left side elevational view thereof;

FIG. 7 is a right side elevational view thereof;

FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2 thereof; and,

FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 8. 

CLAIM The ornamental design for a sealing material ring for a semiconductor manufacturing apparatus, as shown and described. 